Design, Packaging & Manufacturing
of Electronics
We offer electronic and microprocessor
based designs for product development and/or enhancement.
Our specialty is miniaturization and microprocessor integration.
By designing the electronics into a product, thus eliminating
circuit cards, we can produce more compact, robust product
that offers 30% to 50% cost reduction while offering more
features. We offer future technology by designing state-of-the-art
product as a licensed application house for Texas Instruments
and MicroChip.
View
a case study - click here.
We offer full electronics design
capability specializing in Temperature and Motor controls,
Battery charger and Power applications employing Microcontrollers
and Digital Signal Processors (DSP's) as well as discrete
designs; Printed Wiring Board design capability for both Through
Hole and Surface Mount Technology and Full electronic packaging
capability to integrate electronics into the final product
to optimize the cost/benefit of the product.

Surface Mount Technology:
APS SPR25 Stencil Printer
APS P40 Pick and Place machine
APS Goldflow GF12 Reflow Oven
Through Hole Technology:
Novastar 8" Dual Wave soldering
machine
Local Production Capacity:
Full through hole and Surface mount technology capability
for quantities from 1 (prototype) through 10,000 pieces per
year production. Full electronic testing capability to support
production is performed to guarantee our results. Higher volume
production is available via our outsourcing relationships
within the Anderson Group.
For more information on the above, please
contact us.
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