Engineering Services: Electronics

Design, Packaging & Manufacturing of Electronics

We offer electronic and microprocessor based designs for product development and/or enhancement. Our specialty is miniaturization and microprocessor integration. By designing the electronics into a product, thus eliminating circuit cards, we can produce more compact, robust product that offers 30% to 50% cost reduction while offering more features. We offer future technology by designing state-of-the-art product as a licensed application house for Texas Instruments and MicroChip.

View a case study - click here.

We offer full electronics design capability specializing in Temperature and Motor controls, Battery charger and Power applications employing Microcontrollers and Digital Signal Processors (DSP's) as well as discrete designs; Printed Wiring Board design capability for both Through Hole and Surface Mount Technology and Full electronic packaging capability to integrate electronics into the final product to optimize the cost/benefit of the product.

Production Equipment list:

Surface Mount Technology:

APS SPR25 Stencil Printer
APS P40 Pick and Place machine
APS Goldflow GF12 Reflow Oven

Through Hole Technology:

Novastar 8" Dual Wave soldering machine

Local Production Capacity: Full through hole and Surface mount technology capability for quantities from 1 (prototype) through 10,000 pieces per year production. Full electronic testing capability to support production is performed to guarantee our results. Higher volume production is available via our outsourcing relationships within the Anderson Group.

For more information on the above, please contact us.

 

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